SCONDAR SCT1252WVSF‑2x – High‑Density Dual Row SMD Vertical Header, Compatible with Hirose DF13EA‑xxDP‑1.25V Series
Introduction
The relentless drive for miniaturization in electronics demands connectors that pack more contacts into less board space while maintaining reliable performance. The 1.25mm pitch dual row configuration has emerged as a solution, offering up to 40 contacts with approximately 30% higher mounting density compared to single row designs. The SCONDAR SCT1252WVSF‑2x is a dual row, surface‑mount (SMD) vertical header designed to meet these exacting requirements. It serves as a reliable, form‑fit‑function compatible alternative to the Hirose DF13EA‑xxDP‑1.25V double row straight SMT pin header, enabling design engineers to achieve high‑density interconnections without PCB redesign or requalification.
Direct Compatibility with Hirose DF13EA‑xxDP‑1.25V
The SCT1252WVSF‑2x is a mechanical and electrical alternative to the Hirose DF13EA‑xxDP‑1.25V series. It shares the same 1.25mm pitch, dual row vertical SMT configuration, identical pin counts (from 10 to 40 contacts in increments of 10, 14, 20, 30, 40 – corresponding to 2×5, 2×7, 2×10, 2×15, 2×20 positions), and compatible PCB footprint. When mated with standard dual row crimp housings (such as SCONDAR SCT1252H‑2x series or DF13‑series socket housings) and appropriate crimp terminals (SCT1252T / DF13‑2630SCF), the SCT1252WVSF‑2x ensures seamless integration into existing DF13‑based designs.
Key Specifications
All electrical and environmental ratings below are taken directly from the provided product specification:
These specifications meet the demands of signal and low‑power applications in compact electronic devices.
Space‑Efficient Dual Row Design for Maximum Density
The SCT1252WVSF‑2x adopts a dual row configuration that achieves up to 40 contacts while occupying significantly less board area than a single row equivalent. Compared to single row 1.25mm pitch headers, the dual row design reduces the required mounting area by approximately 30%, enabling higher circuit density in space‑constrained applications such as portable medical devices, wearables, and compact industrial controls.
The SMD vertical (straight) type is designed for low‑profile mounting. When soldered onto a PCB, the typical mounting height is approximately 5.8mm (comparable to the DF13EA SMT straight type), allowing use in slim enclosures.
Dimensional Overview
The SCT1252WVSF‑2x is available in five standard dual row configurations. The table below provides the overall housing dimensions (A and B) based on the ordering information (exact mechanical drawings are available from SCONDAR):
Note: Dimensions are for reference. Please consult the official SCONDAR datasheet for full mechanical drawings and PCB layout recommendations.
Robust Material Selection for Reliable SMT Soldering
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Housing: Nylon 9T (PA9T) with UL94V‑0 flame rating. PA9T is a high‑temperature thermoplastic specifically formulated for surface‑mount applications. It exhibits excellent heat resistance during reflow soldering (capable of withstanding peak temperatures up to 260°C), low moisture absorption, and superior dimensional stability.
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Contacts: Brass substrate with gold plating. The gold finish provides excellent corrosion resistance, low contact resistance (20mΩ max), and ensures reliable signal integrity even in low‑voltage, low‑current circuits. Gold plating also supports multiple mating cycles.
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Color: Natural beige housing for easy visual identification during assembly and inspection.
Designed for Automated Assembly (Pick & Place Compatible)
Like the DF13EA series, the SCT1252WVSF‑2x is engineered for high‑volume automated assembly:
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Vacuum pick‑and‑place compatible – The top surface of the header provides a flat, unobstructed area for vacuum nozzles, enabling reliable placement by SMT machines.
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Embossed tape packaging (Code 1) – Supplied in tape‑and‑reel format for automatic mounting, matching the DF13 series’ support for embossed tape packaging.
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Tube packaging (Code 2) – Available as an alternative for hand assembly or existing tube‑fed processes.
This flexibility allows seamless integration into existing DF13‑based production lines without additional tooling or process changes.
Scoop‑Proof Box Structure for Mis‑Insertion Prevention
The SCT1252WVSF‑2x housing incorporates a scoop‑proof box structure – a recessed shroud that completely prevents mis‑insertion of the mating socket housing. This feature protects the delicate pin terminals from damage during blind mating and ensures correct polarization every time. The box structure also provides additional mechanical stability to the SMT solder joints.
Application Areas
The high density, low profile, and reliable gold‑plated contacts make the SCT1252WVSF‑2x ideal for a wide range of compact electronic devices, including:
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Portable medical equipment – Patient monitors, diagnostic instruments, wearable health devices
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Consumer electronics – Smartphones, tablets, digital cameras, portable audio players
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Industrial controls – Compact PLCs, human‑machine interfaces (HMIs), sensor modules
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LED lighting systems – Driver boards, modular lighting arrays
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Security systems – IP cameras, access control panels, alarm peripherals
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Automotive – Interior electronics (infotainment, climate control, navigation) – non‑safety critical
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Telecommunications – Small form‑factor network equipment, routers, modems
Why Choose SCONDAR SCT1252WVSF‑2x?
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Form‑fit‑function compatibility with Hirose DF13EA‑xxDP‑1.25V – no PCB footprint changes required.
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High contact density – Up to 40 contacts in a compact dual row package, saving 30% board space versus single row.
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Superior material – PA9T housing for reflow soldering reliability; gold‑plated brass contacts for low and stable contact resistance (20mΩ max).
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Wide operating temperature (-40°C to +85°C) suitable for harsh environments.
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Automation ready – Tape‑and‑reel packaging (or tube) with vacuum pick‑and‑place compatible design.
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Cost‑effective alternative with shorter lead times and flexible MOQ.
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RoHS compliant and manufactured under stringent quality control.
Conclusion
The SCONDAR SCT1252WVSF‑2x dual row SMD vertical header delivers a reliable, high‑performance alternative to the Hirose DF13EA‑xxDP‑1.25V series. With matching 1.25mm pitch, dual row configurations from 10 to 40 contacts, robust PA9T housing, gold‑plated contacts, and full support for automated assembly, it meets the demanding requirements of modern high‑density electronic designs. Whether you are developing a new compact product or seeking a qualified second source, the SCT1252WVSF‑2x offers the compatibility, reliability, and value you need.
