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Micro-Fit 3.0mm Pitch Connectors

SCT3001 Series

SCT3001 series are replacement of Molex Micro-Fit 3.0™ Connectors 3.0 mm pitch high-density, low-power connector system available in wire-to-wire and wire-to-board configurations

Specification

SeriesSCT3001 Series
Contact Pitch3.0mm
No.of Contacts1 to 12, 2*1 to 2*12 positions
Current5A (AWG #20 to #24)
CompatibleCross Molex 43025/43045 Connector Series

Select Components

Cable Assemblies Refer

Molex Micro Fit Cable Diagram

General Specification

Current Rating:5A
Voltage Rating:250V
Temperature Range:-40°C~+105°C
Contact Resistance:10m Omega Max
Insulation Resistance:1000M Omega Min
Withstanding Voltage:1500V AC/minute

Molex Micro-Fit 3.0mm™ Connectors

Introduction

  • This connector is a unique connector precisely built for larger power connections. Unlike the other connectors, Micro-Fit is rarely used in consumer electronics, but rather, on more complex systems in which its small size and high current capacity is highly benefited.
  • Delivers a current rating up to 5.5 A for American Wire Gage (AWG) #20 – #30.
  • They are designed for blind-mating applications available in 2-24 circuit sizes for single and dual row applications such as computer motherboards, automotive PC power supply, HP printers and Cisco routers.
  • Enclosing this connector is a crimp style lock designed by Scondar and a special configuration which prevents users from inverted insertion.

Features of Molex Micro-fit

High Durability, Low Mating Force

Utilizing Terminal Protection Assurance(TPA) Technology, Scondar manufactures Molex Micro Fit 3.0mm with enhancements in its connector housing and contact design to help prevent connection failure. TPA designs offer overlooked connection solution by providing locking redundancy. This promotes durable connector design in which terminals can be inserted properly without degradation from unnecessarily exhausting them with thousands of insertions.

Equipped with Reduced Mating Force (RMF) Solutions

Reduced Mating Force (RMF) solutions are also achieved in Scondar’s Micro Fit designs with lower friction force between the contacts of the device and the socket, making insertion and removal of the device easier, while at the same time eliminating the need for the complex mechanisms such as in ZIF sockets.

Designed for Blind-Mating Applications

Micro-Fit 3.0 BMI Connectors have blind mated connections, differentiated from other types of connectors by the mating action that happens through a sliding or snapping action which can be accomplished without wrenches or other tools.

Superior Signal Integrity

This type of solution is ideal for applications where there is a need for superior signal integrity with multiple reliable and repeatable connections at 70GHz+. Blind-mated solutions are viable for systems such as the following:

  • High speed digital test head interfaces
  • Probe card docking stations
  • High Speed digital OEM equipment
  • RF Channel system mating on testers
  • Automated probing of backplane channels or high speed signal ports

Robust and Ruggedized Terminal Enhancements

Electrical signals and power solutions are reliably conducted through connections under conditions of high current through enhanced terminal connections.

Surface Mount (SMT) Option, Press Fit (PFT) or Surface Mount Compatible Versions Available

Surface Mount (SMT) and Press Fit (PFT) both meet different needs for a broad range of electrical/electronic circuits. Press Fit Technology is often used in big connections with a reflow soldering process. Surface mounting technology (SMT) is a state of the art soldering process step applying numerous electronic components to a PCB. While SMT option is common and widely used in electronic systems, SMT has certain limitations over PFT depending on application. Scondar can offer PFT or SMT option to meet your application need.

Optimized Safety Feature for Electrical Shock Hazard

With its improved product enhancement, the connector has the capability of withstanding voltage of 1500 V AC per minute, which means to say that the insulation is sufficient to protect the user from electrical shock, overheating and fire.

User-friendly, with its completely polarized housing

Scondar has an improved design configuration of this connector paving an easier way for users to prevent the plug and receptacle from being mismated, causing stress on the connector.

Applicable in Chassis Wiring and Power Transmission Wiring

Scondar’s 3.0 mm Molex Micro Fit can be used for AC and DC operations with a rated current of 5.5 amperes and 250 Volts. It is applicable in both chassis wiring and power transmission wiring.

Fully Shrouded Header

The pin header of the connector is wrapped with a thin plastic guide box around it good for preventing cable connection mishaps and it also provides good guidance for the mating connector.

Savvy Material and Finish

The header contact is made up of copper alloy, tin plated over a phosphor bronze material.

The housing is made of Nylon66 UL94V-0 natural ivory. These housings are available with or without protrusions.

The wafer is made up of Nylon66/46 UL94V-0.

The solder tabs are made up of brass, copper undercoated or tin-plated. These two solder tabs assure that retention of header to PCB connection and act as a strain relief for the SMT solder tails minimizing the chance of solder joints breakage.

Vast Temperature Range with Relatively Low Insulation and Contact resistance

There’s a dimple at the center of the contact which ensures positive contact and low contact resistance at all times. Insulation resistance and contact resistance are of 1000 Mega ohm per minute minimum and 10 Mega ohm maximum, respectively.

The temperature range for this connector is -40 degrees centigrade to +80 degrees centigrade. This range is based on the rise of temperature with increasing current.

Item Packaging

The housing and wafer package are available as 1000 Pcs per bag.

For terminal purpose the available package offers 15,000 pcs per bag.

For wire harness, you can ask for custom materials with 1000 Pcs/bag.

Advantage of Molex Micro-fit

Small electronics with high current requirements

One of the strongest advantage of the Micro Fit series is its applicability in delivering the high current requirement in electronics with supplying high power.

Safe and Reliable

Scondar’s Micro Fit connectors ensure safety, system protection and performance with its bonded metallic conduits and multiple grounding points preventing fire hazards, component damage, overheating and possible electrocution.

ROHS Compliant

The product does not contain restricted chemicals in concentrations not complying with ROHS standards. Thus, for its components, the products can be worked upon at high temperatures required by lead-free soldering.

Application of Molex Micro-fit Connector

Motherboard Connectors

The Motherboard of a computer holds together many of the crucial components such as the central processing unit (CPU), memory and connectors for input and output devices. Microfit connectors ensure high performance electronic system in quality motherboards.

You can easily find Scondar’s Microfit in most ITX Motherboards, in which its functionality is best described for solid performance in a small footprint, and low power consumption (less than 100 Watts).

Printer Connectors

The 3.0mm Microfit can also be seen in most printers

Automotive PC Connectors

Smart, high power automotive PC power supply garners its capabilities from quality Microfit connectors, designed for general purpose battery powered applications. These are manufactured to provide power and to control the motherboards’ switch based on ignition status.

Solar Panels

Microfit can also be commonly found in a solar array. A solar array is connected to each other, and to inverters through connectors to produce a successful flow of electricity.

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