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BMxxB-SRSS-TB

SCT1001WVS

Технические характеристики

Название деталиВертикальный заголовок SMD
Pitch1,0 мм
СерияSCT1001
СовместимостьBMxxB-SRSS-TB Series

Номер детали Перекрестная ссылка

СКОНДАР П/НJST P/NСхемы
SCT1001WVS-02E1BE101BM02B-SRSS-TB2
SCT1001WVS-03E1BE101BM03B-SRSS-TB3
SCT1001WVS-04E1BE101BM04B-SRSS-TB4
SCT1001WVS-05E1BE101BM05B-SRSS-TB5
SCT1001WVS-06E1BE101BM06B-SRSS-TB6
SCT1001WVS-07E1BE101BM07B-SRSS-TB7
SCT1001WVS-08E1BE101BM08B-SRSS-TB8
SCT1001WVS-09E1BE101BM09B-SRSS-TB9
SCT1001WVS-10E1BE101BM10B-SRSS-TB10
SCT1001WVS-11E1BE101BM11B-SRSS-TB11
SCT1001WVS-12E1BE101BM12B-SRSS-TB12
SCT1001WVS-13E1BE101BM13B-SRSS-TB13
SCT1001WVS-14E1BE101BM14B-SRSS-TB14
SCT1001WVS-15E1BE101BM15B-SRSS-TB15
SCT1001WVS-16E1BE101BM16B-SRSS-TB16
SCT1001WVS-17E1BE101BM17B-SRSS-TB17
SCT1001WVS-18E1BE101BM18B-SRSS-TB18
SCT1001WVS-19E1BE101BM19B-SRSS-TB19
SCT1001WVS-20E1BE101BM20B-SRSS-TB20

SCONDAR SCT1001WVS – SignalBee™ Series SMD Vertical Header

1.0mm Pitch | Compact, Low-Profile, High-Reliability | Functional Alternative to JST SH BMxxB-SRSS-TB Series

The 1.0mm pitch crimp-style connector revolutionized wire-to-board connections, earning its place as the industry standard for compact electronic devices. The SCONDAR SCT1001WVS is a 1.0mm pitch SMD vertical header designed to complete the wire-to-board connection system. Serving as a functionally compatible alternative to the JST SH BMxxB-SRSS-TB series, this header delivers the same core engineering principles – compact low-profile design, high-pressure contact interface, and assured connection reliability – while incorporating SCONDAR’s own proprietary tooling, material formulation, and contact geometry.

The SH Legacy – Refined for Modern Surface Mount Assembly

The original SH series earned its place as the world’s first 1.0mm pitch crimp-style connector by delivering:

  • Compact, low-profile design – Enabling dense PCB layouts in portable electronics

  • Housing lance engagement – Excellent performance with small-diameter wires

  • High-pressure contact design – Superior contact reliability and assured connection

The SCONDAR SCT1001WVS carries forward these engineering principles, providing a robust board-side interface for the complete 1.0mm pitch wire-to-board system.

Core Advantages of the SCT1001WVS Header

 
 
Core Principle How SCT1001WVS Delivers
Compact, low-profile design 1.0mm ultra-fine pitch minimizes board occupation; vertical orientation for space-constrained layouts
High-pressure contact interface Optimized pin geometry provides consistent normal force when mated with housing contacts
SMD process compatibility Designed for automated pick-and-place and reflow soldering
Assured connection reliability Precision-stamped contacts with tin plating for stable, low-resistance connections

Electrical & Environmental Specifications

 
 
Parameter Rating
Текущий рейтинг 1A AC/DC
Номинальное напряжение 50 В ПЕРЕМЕННОГО/ПОСТОЯННОГО ТОКА
Insulation Resistance 100MΩ min.
Выдерживаемое напряжение 500VAC for 1 minute
Сопротивление контактов 20mΩ max.
Operating Temperature -40°C to +85°C

Material & Construction – Built for Surface Mount Assembly

 
 
Component Технические характеристики Benefit
Insulator (Housing) PA9T (Polyamide 9T) – UL94V-0 Exceptional heat resistance for reflow soldering
Housing Color Beige Standard industry identification
Contact Material Фосфористая бронза High spring constant, excellent fatigue resistance
Contact Finish Tin Plated Solderable, cost-effective, good corrosion protection

Why PA9T for SMD Headers?

 
 
Property Benefit
High heat deflection temperature Withstands lead-free reflow soldering temperatures (260°C peak)
Low moisture absorption Prevents warpage and dimensional changes during storage and soldering
Excellent chemical resistance Withstands flux and cleaning agents
High mechanical strength Resists damage during automated handling and mating
UL94V-0 flame rating Safety compliance for consumer and industrial electronics

Why Tin-Plated Phosphor Bronze?

 
 
Material/Finish Property Benefit
Phosphor Bronze base Excellent spring properties for consistent contact pressure
Tin plating Solderable – ensures reliable solder joint formation during reflow
Cost-effective Suitable for high-volume consumer applications
Adequate corrosion resistance Reliable performance in indoor/controlled environments

High-Pressure Contact Interface – Assured Connection

When mated with a wire-side housing containing crimped terminals (such as SCONDAR SCT1001T), the SCT1001WVS header pins engage with the high-pressure contact design of the mating terminal:

 
 
Interface Feature Performance Benefit
Optimized pin geometry Provides consistent mating force and normal pressure
Precision-stamped contact surface Low contact resistance (20mΩ max.)
Gas-tight connection High pressure penetrates surface oxides for long-term reliability
Vibration resistance Stable electrical connection under mechanical stress

This high-pressure interface is particularly important for small-diameter wires и low-voltage applications where contact resistance must remain consistently low.

SMD Vertical Header – Key Design Features

 
 
Характеристика Advantage
Vertical orientation PCB space-efficient; ideal for board stacking and edge connections
Surface mount termination Supports automated pick-and-place and reflow soldering processes
Beige insulator Industry-standard color for 1.0mm pitch SH-compatible systems
Polarized housing Prevents mismating with wire-side housing
Surface mount leads Provides strong solder joint retention on PCB

Solder Reflow Compatibility

The SCT1001WVS is designed for standard surface mount assembly processes:

 
 
Process Parameter Capability
Reflow soldering Compatible with leaded and lead-free solder pastes
Peak temperature 260°C (per IPC/JEDEC J-STD-020)
Time above 255°C 30 seconds typical
Number of reflows Up to 2 reflow cycles
Moisture sensitivity level Consult SCT1001WVS specification for MSL rating

Functional Compatibility with JST SH BMxxB-SRSS-TB Series

The SCONDAR SCT1001WVS is engineered to match the key interface dimensions – including 1.0mm pitch, mating envelope, polarizing features, and PCB footprint – of the JST SH BMxxB-SRSS-TB series. This allows:

  • Seamless integration into existing PCB layouts originally designed for SH series vertical headers

  • Mating compatibility with SCONDAR SCT1001H / SCT1001HA housings (which offer dimensional compatibility with JST SHR series housings)

  • Direct footprint compatibility – no PCB redesign required for most applications

However, SCONDAR has developed:

  • Proprietary housing and contact geometry (independent tooling)

  • Unique PA9T material formulation

  • Independent contact forming and plating processes

  • Independent dimensional and performance specifications

This ensures functional compatibility without patent or design infringement. Engineers should always perform application-specific validation.

The Complete 1.0mm Pitch System

The SCT1001WVS is the board-side component of a complete SCONDAR 1.0mm pitch wire-to-board system:

text
┌─────────────────────────────────────────────────────────────────┐
│                  Complete SCONDAR 1.0mm System                   │
├─────────────────────────────────────────────────────────────────┤
│                                                                 │
│   WIRE SIDE                          BOARD SIDE                 │
│                                                                 │
│   ┌──────────────┐                   ┌──────────────────┐       │
│   │ SCT1001H or  │                   │  SCT1001WVS      │       │
│   │ SCT1001HA    │ ◄───── Mated ────► │  (Vertical       │       │
│   │ (Housing)    │                   │   SMD Header)    │       │
│   └──────┬───────┘                   └──────────────────┘       │
│          │                                                      │
│   ┌──────▼───────┐                   ┌──────────────────┐       │
│   │ SCT1001T     │                   │  SCT1001WRS      │       │
│   │ (Terminal)   │                   │  (Right-Angle     │       │
│   └──────┬───────┘                   │   SMD Header)     │       │
│          │                           └──────────────────┘       │
│   ┌──────▼───────┐                                              │
│   │ 28-32 AWG    │                                              │
│   │ Wire         │                                              │
│   └──────────────┘                                              │
│                                                                 │
└─────────────────────────────────────────────────────────────────┘

Target Applications

 
 
Category Specific Use Cases
Бытовая электроника Smartphones, tablets, digital cameras, portable audio, earbuds, gaming handhelds
Wearables Smartwatches, fitness bands, hearables, AR/VR glasses
Медицинские приборы Portable monitors, diagnostic devices, hearing aids, patient wearables
Промышленность Compact sensors, handheld terminals, control panels, test equipment
Office Equipment Printers, scanners, copiers (internal PCB connections)
Automotive (non-safety) Interior lighting modules, infotainment components
Бытовая техника Small kitchen appliances, robotic vacuums, smart home devices

Ordering Information

 
 
Номер детали Description Pitch Ориентация Материал Покрытие Цвет
SCT1001WVS-xxS 1.0mm pitch SMD vertical header 1,0 мм Вертикальный PA9T (UL94V-0) Tin Beige

Note: “xx” indicates number of positions. Available in various pin counts to suit application requirements.

Related Products for Complete System

 
 
Component Part Number Series Description
Standard housing (with flange) SCT1001H 1.0mm pitch crimping housing, white PBT
Flangeless housing SCT1001HA 1.0mm pitch crimping housing, no side flanges
Crimp terminal SCT1001T 28–32 AWG, tin-plated phosphor bronze
Right-angle SMD header SCT1001WRS Alternative board-side orientation

PCB Layout Recommendations

 
 
Parameter Recommendation
Footprint pattern Matches standard 1.0mm pitch SH series pattern
Solder pad size Consult SCT1001WVS datasheet for dimensions
Stencil thickness 0.10–0.12 mm typical
Solder paste type Standard SAC305 or equivalent

Engineering Support

SCONDAR provides:

  • 2D/3D mechanical drawings (STEP, IGES formats)

  • Recommended PCB footprint and stencil patterns

  • Reflow soldering profile recommendations

  • Mating cycle test data

  • Sample headers for process validation

For samples, technical datasheets, or application engineering support, please contact SCONDAR or your authorized distributor.

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