BMxxB-SURS-TF

SCONDAR SCT0800WVS – 0.8mm Pitch SMD Vertical Header

High-Temperature, Low-Profile Connector for Dense Wire-to-Board Applications | Form-Fit-Function Compatible with JST SUR Series

As electronic devices continue to shrink, the demand for ultra-compact, reliable connectors has never been greater. Introducing the SCONDAR SCT0800WVS – a 0.8mm pitch SMD vertical header engineered for high-density wire-to-board connections. This component offers mechanical and electrical compatibility with the JST SUR BMxxB-SURS-TF series, providing engineers with a robust second-source solution without redesigning PCB footprints or sacrificing performance.

World’s First 0.8mm Pitch Insulation Displacement Connector (IDC) System

The SCT0800WVS is part of SCONDAR’s pioneering 0.8mm pitch wire-to-board IDC connector family – the first of its kind in the industry. By reducing the pitch from the conventional 1.0mm (SSR series) to just 0.8mm, the SCT0800WVS enables a 34% reduction in board occupation space (when used with side entry type mating connectors), allowing for more compact PCB layouts and higher component density.

Ultra-Compact Dimensions for Space-Constrained Designs

When paired with corresponding IDC receptacles:

• Side entry type – only 3.9 mm depth и 1.75 mm height after PCB mounting

• Top entry type – only 2.2 mm depth и 3.9 mm height

These miniature dimensions make the SCT0800WVS ideal for portable electronics, wearables, medical devices, and other applications where every millimeter matters.

Electrical & Mechanical Specifications

Advanced Material Selection for Reliability

• Insulator (Housing): LCP (Liquid Crystal Polymer), UL94V-0 rated – excellent heat resistance, low moisture absorption, and dimensional stability suitable for reflow soldering processes

• Color Options: Beige or Black – flexible visual identification for assembly line management

• Контактный материал: Phosphor Bronze with Gold Plating – ensures low and stable contact resistance, superior corrosion protection, and reliable performance over multiple mating cycles

Designed for Compatibility – Respecting Intellectual Property

The SCT0800WVS is engineered as a functional alternative to the JST SUR BMxxB-SURS-TF series. Key interface dimensions – including 0.8mm pitch, mating envelope, and recommended PCB land pattern – are designed to allow seamless integration into existing layouts originally intended for JST SUR connectors.

SCONDAR has developed its own proprietary tooling, contact geometry, and housing design to ensure no direct patent or design infringement. Customers are strongly encouraged to perform validation testing (mechanical fit, electrical continuity, and environmental performance) in their specific application.

Target Applications

• Smartphones and tablets

• Wearable electronics and smartwatches

• Medical sensors and monitors

• Compact battery packs and BMS modules

• IoT sensors and edge devices

• Space-constrained industrial controls

Why Choose SCONDAR SCT0800WVS?

• Space-saving: 34% smaller footprint than 1.0mm pitch alternatives

• Process-friendly: LCP housing withstands high-temperature reflow

• Reliable contact: Gold-plated phosphor bronze with 30mΩ max contact resistance

• Design flexibility: Compatible with both side-entry and top-entry IDC receptacles

• Second-source confidence: Functional equivalent to JST SUR series with independently developed IP

Ordering Information

• Серия: SCT0800WVS

• Тип: Вертикальный заголовок SMD

• Housing Color: Beige or Black (specify when ordering)

• Mating Series: SCONDAR side-entry or top-entry IDC receptacles (or validate compatibility with JST SUR receptacles)

For engineering samples, 2D/3D drawings, or compliance documentation, contact SCONDAR or your authorized distributor.